How to Classify and Characterize Fluxes for High Quality Soldering: J-STD-004C Free Download

J-STD-004: What Is It and Why You Need It

Introduction

If you are involved in soldering electronic components, you know how important it is to use the right soldering flux for your application. Soldering flux is a chemical agent that helps to clean, wet, and bond the metal surfaces during soldering. However, not all soldering fluxes are created equal. Some may be too aggressive, leaving corrosive residues that can damage your circuit board. Others may be too weak, failing to provide adequate wetting and adhesion. How can you ensure that you are using the best soldering flux for your needs?

That's where J-STD-004 comes in. J-STD-004 is a joint industry standard that prescribes general requirements for the classification and characterization of soldering fluxes for high quality solder interconnections. This standard may be used for quality control and procurement purposes, as well as for optimizing your soldering process. In this article, we will explain what J-STD-004 is, what are its benefits, how to classify and characterize soldering fluxes according to it, how it compares with previous versions, and how to apply it in your soldering process.

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What is J-STD-004?

J-STD-004 is a standard developed by the Flux Specifications Task Group (5-24a) of the Assembly and Joining Processes Committee (5-20) of IPC, a global trade association dedicated to the competitive excellence and financial success of its member companies which represent all facets of the electronics interconnect industry. The purpose of this standard is to classify and characterize tin/lead and lead-free soldering flux materials for use in electronic metallurgical interconnections for printed circuit board assembly. Soldering flux materials include the following: liquid flux, paste flux, solder paste, solder cream as well as flux-coated and flux-cored solder wires and preforms.

The standard defines four types of flux materials based on their composition: rosin (RO), resin (RE), organic (OR), and inorganic (IN). Each type of flux material is further classified according to its activity level (from low to high) and its reliability of residue (from low to high) from a surface insulation resistance (SIR) and electromigration standpoint. The standard also specifies whether or not the flux material contains halide activators, which are compounds that enhance the cleaning and wetting properties of the flux but may also increase its corrosiveness. The standard uses a three-character designator to identify both composition and type of fluxes, such as ROL0 (rosin-based flux with low activity and low reliability) or ORH1 (organic-based flux with high activity and high reliability with halides).

What are the benefits of J-STD-004?

Using a soldering flux that complies with J-STD-004 has several benefits for your soldering process and product quality. Some of these benefits are: - You can select the most suitable flux for your application based on its composition, activity, reliability, and halide content. This can help you achieve optimal wetting, spreading, and bonding of the solder joints, as well as minimize defects such as voids, bridges, and icicles. - You can reduce the risk of corrosion and contamination of your circuit board by using a flux that has a low or no halide content and leaves a benign or removable residue. This can improve the electrical performance and reliability of your product, as well as extend its service life. - You can simplify your quality control and procurement processes by using a standard that is widely recognized and accepted by the industry. This can help you avoid confusion and inconsistency when dealing with different suppliers and customers, as well as comply with regulatory requirements and environmental standards.

How to classify and characterize soldering fluxes according to J-STD-004?

To classify and characterize soldering fluxes according to J-STD-004, you need to perform a series of tests on the flux materials to determine their properties and performance. These tests include: - Flux composition analysis: This test determines the type and amount of ingredients in the flux material, such as rosin, resin, organic acids, inorganic acids, activators, solvents, etc. This test is done by using analytical methods such as gas chromatography (GC), infrared spectroscopy (IR), or ion chromatography (IC). - Flux activity level: This test measures the ability of the flux material to remove oxides and other contaminants from the metal surfaces during soldering. This test is done by using methods such as wetting balance (WB), wetting force (WF), or spread factor (SF). - Flux residue reliability: This test evaluates the effect of the flux residue on the electrical characteristics and corrosion resistance of the soldered assembly. This test is done by using methods such as surface insulation resistance (SIR), electromigration (EM), copper mirror (CM), or corrosion (COR). - Flux halide content: This test determines the presence and amount of halide activators in the flux material, such as chloride, bromide, iodide, or fluoride. This test is done by using methods such as potentiometric titration (PT), ion selective electrode (ISE), or ion chromatography (IC). Based on the results of these tests, the flux material is assigned a three-character designator that indicates its composition and type according to J-STD-004. For example, a flux material that has a rosin-based composition, a low activity level, a low reliability of residue, and no halide content would be classified as ROL0.

J-STD-004: A Comparison with Previous Versions

J-STD-004 is not a new standard. It was first published in 1995 as a replacement for MIL-F-14256F, which was a military specification for soldering fluxes that was widely used in the electronics industry. Since then, J-STD-004 has been revised several times to keep up with the changes and challenges in the soldering technology and market. The latest version of J-STD-004 is J-STD-004C, which was published in 2018. In this section, we will compare J-STD-004C with its previous versions: J-STD-004B, which was published in 2011, and J-STD-004A, which was published in 2008.

What are the main differences between J-STD-004A and J-STD-004B?

The main differences between J-STD-004A and J-STD-004B are: - J-STD-004B introduced a new flux type: inorganic (IN), which is composed of inorganic acids and salts. This type of flux is mainly used for soldering aluminum and other metals that require a high activity flux. J-STD-004A did not have this flux type and only recognized three types of fluxes: rosin (RO), resin (RE), and organic (OR). - J-STD-004B added a new test method for flux halide content: ion selective electrode (ISE), which is a more sensitive and accurate method than potentiometric titration (PT). J-STD-004A only used PT as the test method for flux halide content. - J-STD-004B revised the test methods and acceptance criteria for flux residue reliability, especially for surface insulation resistance (SIR) and electromigration (EM). J-STD-004B increased the test duration, test voltage, and test temperature for SIR and EM tests, as well as lowered the minimum acceptable SIR value and the maximum acceptable EM value. These changes were made to reflect the higher reliability requirements for modern electronic assemblies that operate at higher temperatures and voltages. J-STD-004A used less stringent test methods and acceptance criteria for flux residue reliability.

What are the main differences between J-STD-004B and J-STD-004C?

The main differences between J-STD-004B and J-STD-004C are: - J-STD-004C updated the definitions and terminology of some flux terms, such as rosin, resin, organic, inorganic, activator, solvent, etc. J-STD-004C also added some new terms, such as water-soluble flux, no-clean flux, low-residue flux, etc. These changes were made to clarify the meaning and scope of these terms and to align them with other industry standards and documents. - J-STD-004C modified the classification scheme of flux materials by adding a fourth character to the designator that indicates whether or not the flux material is water-soluble. Water-soluble fluxes are those that can be removed by water or water-based solutions without leaving harmful residues. Water-soluble fluxes are designated with a "W" at the end of the designator, such as ROL0W or ORH1W. Non-water-soluble fluxes are those that require other solvents or methods to remove them or are designed to be left on the assembly without causing harm. Non-water-soluble fluxes are designated with an "N" at the end of the designator, such as ROL0N or ORH1N. - J-STD-004C added a new test method for flux activity level: spread factor (SF), which is a visual method that measures the degree of spreading of a solder droplet on a copper coupon after applying a flux material. SF is expressed as a percentage of the area covered by the solder droplet relative to the area of the copper coupon. SF is an alternative method to wetting balance (WB) and wetting force (WF), which are instrumental methods that measure the force or weight change of a solder droplet on a copper coupon after applying a flux material. SF is considered to be more representative of the actual soldering process and more suitable for low activity fluxes.

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J-STD-004: How to Apply It in Your Soldering Process

Now that you know what J-STD-004 is and how it compares with previous versions, you may wonder how to apply it in your soldering process. In this section, we will give you some tips and recommendations on how to use soldering fluxes that comply with J-STD-004 in your soldering process.

What are the best practices for using soldering fluxes that comply with J-STD-004?

Some of the best practices for using soldering fluxes that comply with J -STD-004 are: - Choose the right flux for your application based on its composition, activity, reliability, halide content, and water-solubility. Consider the type of solder alloy, the type of metal surfaces, the soldering method, the operating environment, and the cleaning requirements of your product. For example, if you are soldering lead-free alloys on copper surfaces using a wave soldering method in a humid environment and you need to remove the flux residue after soldering, you may want to use a water-soluble organic-based flux with high activity and high reliability with halides, such as ORH1W. - Follow the manufacturer's instructions and recommendations for storing, handling, applying, and reworking the flux material. Make sure that the flux material is within its shelf life and has not been contaminated or degraded by exposure to heat, light, moisture, or air. Use the appropriate equipment and tools for dispensing, coating, printing, or dipping the flux material on the metal surfaces. Avoid excessive or insufficient application of the flux material that may cause poor wetting, spattering, bridging, or voiding. If you need to rework the solder joints, use a compatible flux material that will not react adversely with the existing flux residue. - Control the soldering parameters and conditions to ensure optimal flux performance and solder joint quality. Adjust the temperature, time, speed, pressure, angle, and distance of the soldering process according to the type and amount of flux material used. Avoid overheating or underheating the flux material that may cause degradation, evaporation, charring, or insufficient activation of the flux. Avoid excessive or insufficient preheating or cooling of the soldered assembly that may cause thermal shock, cracking, or warping of the components or the circuit board. - Clean the flux residue after soldering if required by the product specifications or customer requirements. Use the appropriate cleaning agent and method for removing the flux residue without damaging the solder joints or the circuit board. For water-soluble fluxes, use water or water-based solutions with a suitable temperature, pressure, flow rate, and duration. For non-water-soluble fluxes, use organic solvents or other methods such as ultrasonic cleaning or plasma cleaning. Verify that the cleaning process has removed all traces of flux residue by using methods such as visual inspection, ionic contamination testing, or SIR testing.

What are the common challenges and pitfalls to avoid when using soldering fluxes that comply with J-STD-004?

Some of the common challenges and pitfalls to avoid when using soldering fluxes that comply with J-STD-004 are: - Incompatibility between different types of flux materials. Mixing or switching between different types of flux materials may cause undesirable reactions or interactions that may affect the solderability and reliability of the solder joints. For example, using a rosin-based flux after using an organic-based flux may cause de-wetting or dewetting of the solder joints due to the formation of insoluble salts. To avoid this problem, use only one type of flux material throughout your soldering process or make sure that you thoroughly clean any residual flux before applying a different type of flux. - Inadequate testing and characterization of new or unknown flux materials. Using a new or unknown flux material without testing and characterizing it according to J-STD-004 may result in poor performance or unexpected failures of your product. For example, using a new organic-based flux with high activity and high reliability with halides may cause corrosion or electrochemical migration of your circuit board if you do not clean it properly after soldering. To avoid this problem, always test and characterize any new or unknown flux material according to J-STD-004 before using it in your production process. - Non-compliance with environmental regulations and standards. Using a flux material that contains hazardous substances such as halides, heavy metals, volatile organic compounds (VOCs), etc., may pose health and safety risks for your workers and customers as well as environmental risks for your community and ecosystem. For example, using a flux material that contains halides may violate the Restriction of Hazardous Substances (RoHS) directive, which limits the use of certain hazardous substances in electrical and electronic equipment. To avoid this problem, always check the environmental regulations and standards that apply to your product and market and use a flux material that complies with them. - Misinterpretation or misuse of the J-STD-004 designator. Using the J-STD-004 designator as the sole criterion for selecting or evaluating a flux material may lead to incorrect or inappropriate decisions that may compromise your product quality and reliability. For example, assuming that a flux material with a higher activity or reliability level is always better than a flux material with a lower level may cause overkill or underkill of your soldering process. To avoid this problem, always consider the J-STD-004 designator as a general guideline and not as a definitive specification. Use other factors such as your product requirements, your soldering process parameters, and your flux manufacturer's data sheets and recommendations to make an informed and optimal choice.

How to test and inspect soldering fluxes that comply with J-STD-004?

To test and inspect soldering fluxes that comply with J-STD-004, you need to perform a series of tests on the soldered assemblies to verify their quality and reliability. These tests include: - Visual inspection: This test checks the appearance and condition of the solder joints and the circuit board after soldering. This test is done by using a magnifying lens, a microscope, or a camera to look for any defects or anomalies such as cracks, voids, bridges, icicles, solder balls, cold joints, lifted pads, etc. - X-ray inspection: This test checks the internal structure and integrity of the solder joints after soldering. This test is done by using an x-ray machine or a computed tomography (CT) scanner to look for any defects or anomalies such as voids, cracks, misalignments, etc. - Solderability testing: This test checks the ability of the solder joints to wet and bond with the metal surfaces after soldering. This test is done by using methods such as wetting balance (WB), wetting force (WF), spread factor (SF), or meniscograph (MG). - Mechanical testing: This test checks the strength and durability of the solder joints after soldering. This test is done by using methods such as shear force (SF), pull force (PF), peel force (PL), bend test (BT), shock test (ST), or vibration test (VT). - Electrical testing: This test checks the functionality and performance of the soldered assembly after soldering. This test is done by using methods such as continuity testing (CT), resistance testing (RT), capacitance testing (CT), inductance testing (IT), impedance testing (ZT), or functional testing (FT).

Conclusion

In this article, we have explained what J-STD-004 is, what are its benefits, how to classify and characterize soldering fluxes according to it, how it compares with previous versions, and how to apply it in your soldering process. We hope that this article has helped you understand and appreciate this important standard for soldering fluxes.

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Thank you for reading this article. If you have any questions or comments, please feel free to contact us. We would love to hear from you.

Summary of the main points

• J-STD-004 is a joint industry standard that prescribes general requirements for the classification and characterization of soldering fluxes for high quality solder interconnections.

• J-STD-004 defines four types of flux materials based on their composition: rosin (RO), resin (RE), organic (OR), and inorganic (IN). Each type of flux material is further classified according to its activity level, its reliability of residue, and its halide content.

• J-STD-004 uses a three-character designator to identify both composition and type of fluxes, such as ROL0 or ORH1. J-STD-004C also adds a fourth character to indicate whether or not the flux material is water-soluble , such as ROL0W or ORH1W.

• Using a soldering flux that complies with J-STD-004 can help you achieve optimal wetting, spreading, and bonding of the solder joints, reduce the risk of corrosion and contamination of the circuit board, simplify your quality control and procurement processes, and comply with environmental regulations and standards.

• To classify and characterize soldering fluxes according to J-STD-004, you need to perform a series of tests on the flux materials to determine their composition, activity level, residue reliability, and halide content.

• J-STD-004 has been revised several times to keep up with the changes and challenges in the soldering technology and market. The latest version is J-STD-004C, which was published in 2018. J-STD-004C updated the definitions and terminology of some flux terms, added a new flux type (inorganic), added a new test method for flux activity level (spread factor), and modified the classification scheme of flux materials by adding a fourth character to indicate water-solubility.

• To apply J-STD-004 in your soldering process, you need to choose the right flux for your application, follow the manufacturer's instructions and recommendations for using the flux material, control the soldering parameters and conditions to ensure optimal flux performance and solder joint quality, clean the flux residue after soldering if required, and test and inspect the soldered assemblies to verify their quality and reliability.

Call to action

If you want to learn more about J-STD-004 and download a free copy of the standard, visit [this link]. You can also find other useful resources and information about soldering fluxes and other soldering materials on [this website]. If you have any questions or feedback about this article or J-STD-004, please leave a comment below or contact us via [this form]. We would love to hear from you.

FAQs

• What is the difference between rosin and resin?Rosin is a natural substance derived from pine trees or other plants. Resin is a synthetic substance made from petroleum or other sources. Both rosin and resin are used as base materials for soldering fluxes.

• What is the difference between water-soluble and no-clean fluxes?Water-soluble fluxes are those that can be removed by water or water-based solutions without leaving harmful residues. No-clean fluxes are those that are designed to be left on the assembly without causing harm. Both water-soluble and no-clean fluxes are types of non-water-soluble fluxes according to J-STD-004C.

• What is the difference between wetting balance and wetting force?Wetting balance and wetting force are two methods for measuring the flux activity level. Wetting balance measures the force or weight change of a solder droplet on a copper coupon after applying a flux material. Wetting force measures the force exerted by a solder droplet on a copper coupon after applying a flux material.

• What is the difference between surface insulation resistance and electromigration?Surface insulation resistance and electromigration are two methods for measuring the flux residue reliability. Surface insulation resistance measures the electrical resistance of the circuit board surface after applying a flux material. Electromigration measures the movement of ions or electrons across the circuit board surface after applying a flux material.

• What is the difference between potentiometric titration and ion selective electrode?Potentiometric titration and ion selective electrode are two methods for measuring the flux halide content. Potentiometric titration measures the amount of acid or base needed to neutralize a sample of flux material. Ion selective electrode measures the concentration of halide ions in a sample of flux material.

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